Polymer Assembly Technology (PAT) is a leading provider of precision flip chip assembly services for fine-pitch imaging devices and temperature-sensitive devices. With over 45 years of experience, PAT offers unique solutions using low-cost, low-temperature curing epoxies, providing high-density interconnections at a lower cost compared to traditional methods.
Founded in 2003 by Jim Clayton, PAT collaborates with government and university research labs to develop imaging devices for various applications. Committed to quality and ethical standards, PAT strives to deliver exceptional microelectronic interconnect solutions through continuous technical improvement.
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